To protect the solder pads for oxidation and to make the copper better solder able we can apply Lead-free HAL on the pads. The material used is Sn.

HAL or Hot Air Leveling means that the production panel is vertically dipped into a bath of liquid tin. While pulling the panel out of the bath, two hot air knives blow of the surplus of Tin so the holes are again free and all pads and planes are nicely flat.

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