New direct imaging technology – more capacity, more design options
2015 – a record start to the year
Medium-volume BINDI pool now UL approved – and 4 layers soon
Eurocircuits sponsor student projects
Direct-imaging technology
MORE CAPACITY
The Ledia V5 direct-imaging system, installed in January, is our largest single investment in a single piece of equipment – and is already paying off. Direct imaging has boosted our production capacity in time to handle the fastest growth in orders we have seen in years. See how it works in our technical BLOG.
MORE DESIGN OPTIONS
The reliable assembly of new-generation BGAs, QFNs and fine-pitch leaded components demands tighter-toleranced soldermasks. Ledia images finer soldermask dams than conventional phototools. We will use it in conjunction with our forthcoming solder-bridge pre-CAM tool to produce the optimum soldermask solution for your designs.
2015 – a record first quarter
Q1-2015 we served more than 5,500 customers with almost 24,000 orders. Thus we are up 15.8% and 18.5% on the first quarter of 2014. And 2014 was already a record year.
BINDI pool news
Our BINDI pool service for orders up to 50 m2 is now UL approved. UL marking can be added to your boards at no extra cost
From May BINDI pool will offer 4-layer multilayers as well as 2-layer PCBs
Student project sponsorship
We have sponsored student projects across Europe for many years as part of our commitment to foster new generations of electronics designers. See our BLOGS for some recent projects. If you are looking for sponsorship for a student or educational project, contact us at euro@eurocircuits.com.
Technical blogs
Some recent highlights, all now available in English, French. Spanish and Portuguese:
Looking back at 2014: our results for 2014 and the new products and services launched
If you would like us to produce a blog or white paper on a particular aspect of PCB manufacturing technology, PCB soldering or EAGLE CAD, email us at euro@eurocircuits.com.
Meet us
The best way to share ideas and knowledge is face to face. Come and meet us at:
